光弹法实测正交异性双材料界面裂纹断裂参数

DETERMINATION OF FRACTURE PARAMETERS FOR INTERFACE CRACK IN ORTHOTROPIC BI-MATERIALS BY PHOTOELASTIC METHOD

  • 摘要: 采用光弹贴片法实测正交异性双材料界面裂纹尖端区域的应力应变场,进而求出界面裂纹的断裂力学参量. 将正交异性双材料板加工成拉伸试件,在聚碳酸酯贴片的单侧表面镀金属铝膜,以提高贴片的反射效率. 沿贴片后的双材料界面预制裂缝,逐渐加大载荷,得到一系列清晰的等差线条纹图. 利用正交异性双材料界面裂纹尖端应力分量表达式计算出应力强度因子. 实验表明,光弹贴片法可有效地分析正交异性双材料界面裂纹问题.

     

    Abstract: The stress-strain field of interface crack tip inorthotropic bi-materials is determined by photoelastic coating in thispaper, and the fracture mechanics parameters for interface crack arederived. Orthotropic bi-materials panel is made into a tension specimen,and metallic-aluminum coating is plated in the surface of unilateralpolycarbonate coating to enhance the reflectivity of polycarbonate coating.Then the load along the interface prefabricated cracks of bi-materials isgradually increased, a series of clear equi-difference lines canbe observed. Stress intensity factor can be calculated by using stresscomponent expressions for interface crack in orthotropic bi-materials. Thetesting-result indicates that photoelastic coating can effectively analyzethe problem for interface crack in orthotropic bi-materials.

     

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