Abstract: When thermal barrier coatings (TBCs) are madeinto laminate in micro/nano scale, the heat transfer theory in macroscale, Fourier heat equation, can not be used. But it can stillbe used in the substrate under TBCs. In this paper, the temperaturefield obtained from combining non-Fourier heat conduction model forTBCs and Fourier heat conduction model for substrate is used as thethermal load in the finite element analyses of thermal stress and J-integralof an edge crack in the TBCs. Influence of thermal diffusivity ofsubstrate on the TBCs thermodynamic properties (temperature field,thermal stress and J-integral) is analyzed. The conclusion is that influencetakes effect in the final thermal shock.