胶补加筋板应力强度因子及胶层剪应力计算

CALCULATION OF STRESS INTENSITY FACTOR FOR A BONDED REPAIR STIFFENED PANEL AND SHEAR STRESS IN THE ADHESIVE BOND BETWEEN PATCH AND PLATE

  • 摘要: 在铆钉力法的基础上,提出计算胶接修补加筋板结构应力强度因子及胶层剪应力的解析法,对分析胶接修补的加筋板强度具有现实意义. 利用影响系数,可以得到筋条、补片及蒙皮位移的表达式,根据位移协调条件,建立联立方程,从而得到胶层剪应力及铆钉力. 通过解析式,计算裂纹尖端的应力强度因子,分析补片对结构修补的效果,综合考虑了筋条及补片对应力强度因子的影响.

     

    Abstract: Based on the method of the rivet force, an analytic methodfor calculating the stress intensity factor (SIF) for a bonded repairstringer plate and the shear stresses in the adhesive bond between patchand plate is presented. The method can be used to determine thestrength of a bonded repair stringer plate.The expressions ofdisplacements of stringer, patch and plate are obtained by usinginfluence coefficients. According to the condition of displacement compatibility, a truncated set of simultaneous equations is obtained. Thusthe shearstresses in the adhesive bond between patch and plate and the forces ofrivet can be obtained. The SIF at the crack tip can be calculated by ananalytic expression. The influence of stringer and patch on SIF isfully considered, and then the repair effect is analyzed.

     

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