显微云纹技术在微电子器件力学测量中的应用

APPLICATION OF MICRO-MOIR\'E TECHNIQUE TO MECHANICS MEASUREMENT FOR MICRO-ELECTRONIC DEVICES

  • 摘要: 电子工业的不断发展促进了电子器件的微小型化,作为新型产品设计基础的微电子器件可靠性分析成为人们非常关注的问题. 力学参数的测量可以为可靠性评价提供有价值的实验依据.概括总结了显微云纹技术的发展,主要介绍了云纹干涉法和扫描显微镜云纹方法及其在微电子器件全场变形场测量中的应用.

     

    Abstract: The micro-miniature of electronic devices isgreatly promoted by the rapid development of electronics industry. Thestudy on the reliability of the micro-electronic devices is the foundationof designing novel electronic products, and has drawnmuch attention of researchers. The parameters of mechanical behaviorobtained from experiment are the basis of reliability analysis. In this study, thedevelopment of micro-moir\'e methods is reviewed, covering moir\'einterferometry, scanning electronic microscope moir\'e methods and theirapplications to analysis of mechanical behavior of the micro-electronicdevices are discussed.

     

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